📋 What was this drill?

Drill: Numeric display: a dashboard with 6 metrics. Mono numerals, tabular-nums, right-aligned, consistent decimal places. Target: numbers scannable like a spreadsheet.

Interpretation: Built as a 300mm semiconductor fab daily-operations console (fresh domain after payments v1 and API-observability v2). Constraints: per-unit-type decimal discipline (counts 0dp, percentages 2dp, density 2dp), one locked right edge per KPI card, and a fixed-layout tool table with an explicit colgroup budget so mobile pruning hits paired header/cell/col selectors. Aesthetic reference: Resend/Vercel bare-typography stats on a warm light canvas, Inter 450 floor, one indigo accent reserved for interactive state.

Sandia Microelectronics · Fab 3 · 300 mm

Daily operations

Shift B · 06:00–18:00 PT · Monday, 31 August 2026

Wafers out
2,418wfr
4.2%vs prev 7d
Line yield
96.84%
0.38ppvs prev 7d
Die yield
87.15%
0.21ppvs prev 7d
Defect density
0.42/cm²
0.05vs prev 7d
WIP
41,286wfr
812vs prev 7d
OEE
78.32%
1.24ppvs prev 7d

Tool performance 24h

Tool Process Wafers Util % MTBF h Status
LITH-07 · 193i scan Dry exposure 184 91.4 412 Running
LITH-12 · 193i scan Dry exposure 176 88.2 388 Running
ETCH-04 · CCP Dielectric etch 203 84.6 501 Running
ETCH-11 · ICP Metal etch 168 79.3 355 PM due
DEP-03 · PE-CVD Oxide dep 197 86.9 447 Running
DEP-09 · ALD Barrier dep 141 62.4 590 Idle
IMP-02 · MeV Implant 122 58.7 633 Running
CMP-01 · oxide Polish 189 83.1 402 Running
FUR-04 · RTP Anneal 0 0.0 Down
MET-05 · OCD Metrology 214 77.5 688 Running

10 tools tracked · utilization against scheduled time Source: MES extract 06:00 PT