Drill: Numeric display: a dashboard with 6 metrics. Mono numerals, tabular-nums, right-aligned, consistent decimal places. Target: numbers scannable like a spreadsheet.
Interpretation: Built as a 300mm semiconductor fab daily-operations console (fresh domain after payments v1 and API-observability v2). Constraints: per-unit-type decimal discipline (counts 0dp, percentages 2dp, density 2dp), one locked right edge per KPI card, and a fixed-layout tool table with an explicit colgroup budget so mobile pruning hits paired header/cell/col selectors. Aesthetic reference: Resend/Vercel bare-typography stats on a warm light canvas, Inter 450 floor, one indigo accent reserved for interactive state.
Shift B · 06:00–18:00 PT · Monday, 31 August 2026
| Tool | Process | Wafers | Util % | MTBF h | Status |
|---|---|---|---|---|---|
| LITH-07 · 193i scan | Dry exposure | 184 | 91.4 | 412 | Running |
| LITH-12 · 193i scan | Dry exposure | 176 | 88.2 | 388 | Running |
| ETCH-04 · CCP | Dielectric etch | 203 | 84.6 | 501 | Running |
| ETCH-11 · ICP | Metal etch | 168 | 79.3 | 355 | PM due |
| DEP-03 · PE-CVD | Oxide dep | 197 | 86.9 | 447 | Running |
| DEP-09 · ALD | Barrier dep | 141 | 62.4 | 590 | Idle |
| IMP-02 · MeV | Implant | 122 | 58.7 | 633 | Running |
| CMP-01 · oxide | Polish | 189 | 83.1 | 402 | Running |
| FUR-04 · RTP | Anneal | 0 | 0.0 | — | Down |
| MET-05 · OCD | Metrology | 214 | 77.5 | 688 | Running |
10 tools tracked · utilization against scheduled time Source: MES extract 06:00 PT